High-Speed Flex-Circuit Chip-to-Chip Interconnects-Reference-Cited by-同舟云学术

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High-Speed Flex-Circuit Chip-to-Chip Interconnects

Published:2008-02 Issue:1 Volume:31 Page:82-90
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Braunisch H.,Jaussi J.E.,Mix J.A.,Trobough M.B.,Horine B.D.,Prokofiev V.,Daoqiang Lu ,Baskaran R.,Meier P.C.H.,Dong-Ho Han ,Mallory K.E.,Leddige M.W.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4447317/04383139.pdf?arnumber=4383139

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. P‐9.3: A Typical Interconnect Model for High Bandwidth Video Streaming Transmission in Mixed‐Reality Devices;SID Symposium Digest of Technical Papers;2024-04

2. Toward 224-Gb/s Electrical Signaling—Modulation, Equalization, and Channel Options;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-03

3. Impact of Use Conditions on Dielectric and Conductor Material Models for High-Speed Package Interconnects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-10

4. Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate;Transactions of The Japan Institute of Electronics Packaging;2018

5. Design Techniques for a 60-Gb/s 288-mW NRZ Transceiver With Adaptive Equalization and Baud-Rate Clock and Data Recovery in 65-nm CMOS Technology;IEEE Journal of Solid-State Circuits;2017-12

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