Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging-Reference-Cited by-同舟云学术

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Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging

Published:2021-11 Issue:11 Volume:36 Page:12141-12145
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Wang Meiyu,Mei Yun-Hui^ORCID,Jin Jingyou,Chen Shi,Li Xin^ORCID,Lu Guo-Quan^ORCID

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9497775/09410406.pdf?arnumber=9410406

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Driving force for enhancing the cold silver sinter joining using time domain-dependent Ag–Au epitaxy and interfacial stress;Materials Science and Engineering: A;2024-09

2. A rapid-sintering Cu-Cu joints with ultrahigh shear strength and super reliability for power electronics package;Materials Science in Semiconductor Processing;2024-08

3. Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications;Electronics;2024-06-03

4. Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint;Soldering & Surface Mount Technology;2024-05-31

5. Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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