An Automated Field-Circuit Coupling Simulation Method Based on PSpice-MATLAB-COMSOL for SiC Power Module Design
Author:
Affiliation:
1. Institute of Artificial Intelligence, Huazhong University of Science and Technology, Wuhan, China
2. School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan, China
Funder
National Natural Science Foundation of China
Hubei Jiufengshan Laboratory
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/10242191/10175613.pdf?arnumber=10175613
Reference24 articles.
1. A Temperature-Dependent Thermal Model of IGBT Modules Suitable for Circuit-Level Simulations
2. Development of a low-inductance SiC trench MOSFET power module for high-frequency application
3. Analysis and Experimental Evaluation of Middle-Point Inductance's Effect on Switching Transients for Multiple-Chip Power Module Package
4. PSpice-COMSOL-Based 3-D Electrothermal–Mechanical Modeling of IGBT Power Module
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