A Current Monitoring Method for Wire-bonding Power Modules based on Magnetoresistance-Planar Rogowski Coil
Author:
Affiliation:
1. Xi’an Jiaotong University,Xi’an,China
2. State Grid Shanghai Electric Power Research Institute,Shanghai,China
Funder
Science and Technology Project of State Grid
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10567049/10567050/10567236.pdf?arnumber=10567236
Reference13 articles.
1. An Automated Field-Circuit Coupling Simulation Method Based on PSpice-MATLAB-COMSOL for SiC Power Module Design
2. Chip-Level Electrothermal Stress Calculation Method of High-Power IGBT Modules in System-Level Simulation
3. Chip-Level Electrothermal Stress Calculation Method of High-Power IGBT Modules in System-Level Simulation
4. A compact planar Rogowski coil current sensor for active current balancing of parallel-connected Silicon Carbide MOSFETs
5. Design of a high-bandwidth Rogowski current sensor for gate-drive shortcircuit protection of 1.7 kV SiC MOSFET power modules
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