A Fast Steady-state Thermal Modeling of Power Modules Based on Fourier Analytic Series
Author:
Affiliation:
1. Xi’an Jiaotong University,China
2. Chongqing University,China
3. State Grid Shanghai Electric Power Research Institute,China
Funder
State Grid Corporation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10567049/10567050/10567496.pdf?arnumber=10567496
Reference9 articles.
1. Effect of Asymmetric Layout and Unequal Junction Temperature on Current Sharing of Paralleled SiC MOSFETs With Kelvin-Source Connection
2. An Automated Field-Circuit Coupling Simulation Method Based on PSpice-MATLAB-COMSOL for SiC Power Module Design
3. A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules
4. A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module
5. Steady-State Thermal Modeling of a Power Module: An $N$-Layer Fourier Approach
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