Influence of Power Cycling Test Methodology on the Applicability of the Linear Damage Accumulation Rule for the Lifetime Estimation in Power Devices
Author:
Affiliation:
1. Department of Management and Engineering, Università degli Studi di Padova, Vicenza, Italy
Funder
Interdisciplinary Strategy for the Development of Advanced Mechatronics Technologies
DTG
University of Padova-Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/10067246/10037217.pdf?arnumber=10037217
Reference46 articles.
1. Failure analysis and lifetime assessment of IGBT power modules at low temperature stress cycles
2. Study on power cycling test with different control strategies
3. A new lifetime model for advanced power modules with sintered chips and optimized Al wire bonds;scheuermann;Proc PCIM Europe Conf Proc,2013
4. Requirements in power cycling for precise lifetime estimation
5. Aging Mechanisms and Accelerated Lifetime Tests for SiC MOSFETs: An Overview
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