Lifetime Prediction for Lift-off of Bond Wires in IGBTs Using Paris Law With Analytical Calculation of Crack Length
Author:
Affiliation:
1. College of Electrical and Information Engineering, Hunan University, Changsha, China
2. CRRC Zhuzhou Electric Locomotive Institute Company Ltd., Zhuzhou, China
Funder
National Natural Science Foundation of China
Huxiang High-level Talent Gathering Project
National Natural Science Foundation of Hunan Province
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/10242187/10173708.pdf?arnumber=10173708
Reference34 articles.
1. Fast power cycling test of IGBT modules in traction application
2. New physical model for lifetime estimation of power modules;kova?evi?;Proc Int Power Electron Conf Energy Convers Congr Expo ASIA,2010
3. Analytical modeling of thermo-mechanical stress for bond wire of IGBT module
4. Model for power cycling lifetime of IGBT modules-various factors influencing lifetime;bayerer;Proc 5th Int Conf Integr Power Syst,2008
5. Acceleration Factors for Lead-Free Solder Materials
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