1. A finite element analysis on the reliability of heavy bonding wire for high power IGBT module[J];Huang;IEEE Trans. Components Packag. Manuf. Technol.,2020
2. Effects of current and bonding wires damage on high-power IGBT module reliability by electro-thermo-mechanical simulation[C];Huang,2020
3. Research on Reliability of IGBT Power Module Packaging[D];Ling,2016
4. Analysis of the performance effect with bonding wires lift-off in IGBT modules[J];Chunlei;Trans. China Electrotechnical Soc.,2014