Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite-Reference-Cited by-同舟云学术

Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite

Published:2022-12 Issue:12 Volume:37 Page:14462-14470
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Zhang Zichen¹^ORCID,Lu Shengchang¹^ORCID,Wang Boyan¹^ORCID,Zhang Yuhao¹^ORCID,Yun Nick²,Sung Woongje²,Ngo Khai D. T.¹^ORCID,Lu Guo-Quan³^ORCID

Affiliation:

1. Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA, USA

2. College of Nanoscale Science and Engineering, State University of New York Polytechnic Institute, Albany, NY, USA

3. Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA, USA

Funder

Advanced Research Projects Agency

Energy of the Department of Energy

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9970584/09827612.pdf?arnumber=9827612

Reference41 articles.

1. Survey of high-temperature polymeric encapsulants for power electronics packaging;yao;IEEE Trans Compon Packag Manuf Technol,2015

2. Mechanism of Migration of Sintered Nanosilver at High Temperatures in Dry Air for Electronic Packaging

3. Desired Properties of a Nonlinear Resistive Coating for Shielding Triple Point in a Medium-Voltage Power Module

4. Packaging Design of 15 kV SiC Power Devices With High-Voltage Encapsulation

5. Study on nonlinear conductivity of copper-titanate-calcium/liquid silicone rubber composites

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