Dielectric and Thermal Analysis of Diamond-Like Carbon Incorporated Power Substrates
Author:
Affiliation:
1. University of Wisconsin-Milwaukee,Department of Electrical Engineering,Milwaukee,WI,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10579099/10579101/10579401.pdf?arnumber=10579401
Reference33 articles.
1. Silicon Carbide as a Platform for Power Electronics
2. Heat management in power converters: From state of the art to future ultrahigh efficiency systems;Laloya,2016
3. Influence of test procedure on dielectric breakdown strength of alumina
4. Multiobjective optimal placement of convectively cooled electronic components on printed wiring boards
5. Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules
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