A 3-D Finite Difference Method for Obtaining the Steady-State Temperature Field of a PCB Circuit
Author:
Affiliation:
1. Microelectronics Science and Engineering, Tongji University, Shanghai, China
2. School of Electrical and Electronic Engineering, Shanghai Institute of Technology, Shanghai, China
Funder
DEMUP
Guangzhou DEMUP Automobile Parts Co., Ltd
Shanghai Institute of Technology with the Industry-University-Research Cooperation Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9952160/09905951.pdf?arnumber=9905951
Reference20 articles.
1. Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions
2. Analysis of the electro-thermal behaviour of multichip power modules
3. Dynamic electro-thermal modeling in Power Electronics Building Block (PEBB) applications
4. The Method of a Fast Electrothermal Transient Analysis of Single-Inductance DC–DC Converters
5. Optimal Control of Traction Motor Drives Under Electrothermal Constraints
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