Decoupling and Reconstruction of Low-Quality Temperature Fields of Printed Circuit Boards
Author:
Affiliation:
1. School of Automation Science and Electrical Engineering, Beihang University, Beijing, China
2. School of Automation Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China
3. Wuhu Machinery Factory, Wuhu, China
Funder
National Key Research and Development Program Funded Projects of China
Wuhu Machinery Factory Science and Technology Cooperation Project with BUAA
Academic Excellent Foundation of BUAA for Ph.D. Students
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/7361/10487994/10443320.pdf?arnumber=10443320
Reference35 articles.
1. IC components reliability concerns for avionics end-users
2. Integrated Circuit Quality and Reliability
3. Reliability of Power Electronic Systems: An Industry Perspective
4. Integrated circuit failure analysis and reliability prediction based on physics of failure
5. A new fault diagnosis approach for analog circuits based on spectrum image and feature weighted kernel Fisher discriminant analysis
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