Experimental Investigations on Current Sharing Characteristics of Parallel Chips Inside Press-Pack IGBT Devices-Reference-Cited by-同舟云学术

Experimental Investigations on Current Sharing Characteristics of Parallel Chips Inside Press-Pack IGBT Devices

Published:2022-09 Issue:9 Volume:37 Page:10672-10680
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Peng Cheng¹^ORCID,Li Xuebao¹^ORCID,Fan Jiayu¹^ORCID,Zhao Zhibin¹^ORCID,Tang Xinling²,Cui Xiang¹^ORCID

Affiliation:

1. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electrical Power University, Beijing, China

2. Power Semiconductor Devices Research Institute, State Key Laboratory of Advanced Power Transmission Technology, Smart Grid Research Institute Company, Ltd., Beijing, China

Funder

National Natural Science Foundation of China

State Grid Corporation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9780877/09749018.pdf?arnumber=9749018

Reference22 articles.

1. Investigation of parallel operation of IGBTs

2. Dynamic paralleling problems in IGBT module construction and application;schlapbach;Proc Int Conf Integr Power Electron Syst,0

3. Optimization of the current distribution in press-pack high power IGBT modules

4. Current sharing of IGBT modules in parallel with thermal imbalance

5. Research and measurement of chip current imbalance in IGBT module with multiple chips in parallel

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3. PCB Rogowski Coil Array With Discrete Electrostatic Shielding for Current Measurement of Paralleled Chips in Power Devices;IEEE Transactions on Power Electronics;2024-08

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5. Comparative Study on Stray Inductance and Current Sharing of a 90kW Inverter Using Multiple Discrete IGBT Devices in Parallel;2024 IEEE 2nd International Conference on Power Science and Technology (ICPST);2024-05-09