Investigation on Saturation Voltage Increment of Multichip Press-Pack IGBTs Under Power Cycling Tests
Author:
Affiliation:
1. State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, China
2. Department of Energy Technology, Aalborg University, Aalborg, Denmark
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/41/10639503/10462681.pdf?arnumber=10462681
Reference28 articles.
1. Multidimensional Mission-Profile-Based Lifetime Estimation Approach for IGBT Modules in MMC–HVdc Application Considering Bidirectional Power Transfer
2. An Accelerated Distance Protection of Transmission Lines Emanating From MMC-HVdc Stations
3. Reliability study and modelling of IGBT press-pack power modules
4. A New Press Pack IGBT for High Reliable Applications With Short Circuit Failure Mode
5. A Study on the Failure Evolution to Short Circuit of Nanosilver Sintered Press-Pack IGBT
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