Author:
Wong B. K.,Yong C.C.,Eu P.L.,Yap B. K.
Cited by
5 articles.
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1. Impact of Via Structure Toward Wire Bond Interconnect Quality;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26
2. Development of a fast method for optimization of Au ball bond process;Microelectronics Reliability;2015-02
3. Concerns and Solutions;Copper Wire Bonding;2013-05-29
4. Bonding Process;Copper Wire Bonding;2013-05-29
5. Copper Wire Bonding Concerns and Best Practices;Journal of Electronic Materials;2013-05-08