Modeling of 300 GHz Chip-to-Chip Wireless Channels in Metal Enclosures-Reference-Cited by-同舟云学术

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Modeling of 300 GHz Chip-to-Chip Wireless Channels in Metal Enclosures

Published:2020-05 Issue:5 Volume:19 Page:3214-3227
ISSN:1536-1276
Container-title:IEEE Transactions on Wireless Communications
language:
Short-container-title:IEEE Trans. Wireless Commun.

Author:

Fu Jinbang^ORCID,Juyal Prateek^ORCID,Zajic Alenka^ORCID

Funder

NSF CAREER ECCS

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Science Applications

Link

https://ieeexplore.ieee.org/ielam/7693/9090043/8989977-aam.pdf

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