Electromigration reliability of low capacitance air-gap interconnect structures-Reference-Cited by-同舟云学术

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Electromigration reliability of low capacitance air-gap interconnect structures

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)
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Author:

Shieh B.P.,Deal M.D.,Saraswat K.C.,Choudhury R.,Park C.-W.,Sukharev V.,Loh W.,Wright P.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7918/21830/01014934.pdf?arnumber=1014934

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Formation of Air Gaps Isolation Used in Metal/Dielectric Stacking;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

2. Airgaps in nano-interconnects: Mechanics and impact on electromigration;Journal of Applied Physics;2016-09-07

3. Airgap Interconnects: Modeling, Optimization, and Benchmarking for Backplane, PCB, and Interposer Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-08

4. Influence of air gaps on the thermal–electrical–mechanical behavior of a copper metallization;Microelectronics Reliability;2011-09

5. Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects;Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications;2009

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