Influence of air gaps on the thermal–electrical–mechanical behavior of a copper metallization-Reference-Cited by-同舟云学术

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Influence of air gaps on the thermal–electrical–mechanical behavior of a copper metallization

Published:2011-09 Issue:9-11 Volume:51 Page:1587-1591
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Bauer Irina,Weide-Zaage Kirsten,Meinshausen Lutz

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling;Ciptokusumo;Microelectron Reliab,2009

2. Ueda T et al. Electrical and mechanical characteristics of next-node cu interconnects with air gaps. in: Proceedings of the AIP conference; conf proc. vol. 1143; 2009. p.172–81.

3. Improving reliability of copper dual-damascene interconnects by impurity doping and interface strengthening;Tada;IEEE Trans Electron Device,2007

4. Determination of migration effects in Cu-via structures with respect to process-induced stress;Weide-Zaage;ESREF,2008

5. Stationary and dynamic analysis of failure locations and void formation in interconnects due to the different migration mechanisms;Weide-Zaage;Mater Sci Semicond Process,2003

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