Hybrid Integration of Screen-Printed RFID Tags and Rigid Microchip on Paper

Author:

Chakraborty Moupali1ORCID,Nikbakhtnasrabadi Fatemeh1ORCID,Dahiya Ravinder1ORCID

Affiliation:

1. Bendable Electronics and Sensing Technologies (BEST) Group, James Watt School of Engineering, University of Glasgow, Glasgow, U.K.

Funder

North West Center for Advanced Manufacturing (NWCAM) Project through the European Union’s INTERREG VA Program

Special EU Programs Body

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. 3D Printed Interconnects for Heterogenous Integration on Flexible Substrates;2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2024-06-30

2. High‐Resolution Printing‐Based Vertical Interconnects for Flexible Hybrid Electronics;Advanced Materials Technologies;2024-06-04

3. Improving Definition of Screen-Printed Functional Materials for Sensing Application;ACS Applied Electronic Materials;2024-04-05

4. Print Durability and Recyclability of Label Paper Equipped with Printed RFID Antenna;Sustainability;2023-12-22

5. Dry-Printing Conductive Circuit Traces on Water-Soluble Papers;ACS Sustainable Chemistry & Engineering;2023-11-03

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