3D Printed Interconnects for Heterogenous Integration on Flexible Substrates
Author:
Affiliation:
1. Northeastern University,Bendable Electronics and Sustainable Technologies (BEST) Group,Electrical and Computer Engineering Department,Boston,MA,USA,02115
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10603449/10603462/10603705.pdf?arnumber=10603705
Reference23 articles.
1. A New Frontier of Printed Electronics: Flexible Hybrid Electronics
2. High-performance printed electronics based on inorganic semiconducting nano to chip scale structures
3. Ultra‐Thin Chips with Printed Interconnects on Flexible Foils
4. Hybrid Integration of Screen-Printed RFID Tags and Rigid Microchip on Paper
5. Ultrathin Ion-Sensitive Field-Effect Transistor Chips with Bending-Induced Performance Enhancement
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