Ultra‐Thin Chips with Printed Interconnects on Flexible Foils-Reference-Cited by-同舟云学术

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Ultra‐Thin Chips with Printed Interconnects on Flexible Foils

Published:2021-12-30 Issue: Volume: Page:2101029
ISSN:2199-160X
Container-title:Advanced Electronic Materials
language:en
Short-container-title:Adv Elect Materials

Author:

Ma Sihang¹,Kumaresan Yogeenth¹,Dahiya Abhishek Singh¹,Dahiya Ravinder¹^ORCID

Affiliation:

1. Bendable Electronics and Sensing Technologies (BEST) Group University of Glasgow Glasgow G12 8QQ UK

Funder

H2020 Future and Emerging Technologies

Engineering and Physical Sciences Research Council

Publisher

Wiley

Subject

Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aelm.202101029

Reference56 articles.

1. Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

2. Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips

3. Energy autonomous electronic skin

4. Fused Deposition Modeling‐Based 3D‐Printed Electrical Interconnects and Circuits

5. Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems

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1. Fabrication of Shape‐Controlled Copper Line Arrays by Meniscus‐Confined 3D Microprinting on Insulating Substrates;Advanced Engineering Materials;2024-08-03

2. 3D Printing of Interdigitated Finger Capacitors Using Ultra-Precise Deposition Technology;2024 25th International Microwave and Radar Conference (MIKON);2024-07-01

3. 3D Printed Interconnects for Heterogenous Integration on Flexible Substrates;2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2024-06-30

4. High‐Resolution Printing‐Based Vertical Interconnects for Flexible Hybrid Electronics;Advanced Materials Technologies;2024-06-04

5. Contact Printed ZnO Nanowires-Based Flexible Photosensitive Devices for Large Area Smart Sensing;IEEE Sensors Letters;2024-06

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