Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization
Author:
Funder
SRC
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Control and Systems Engineering
Link
http://xplorestaging.ieee.org/ielx7/41/7586139/07501510.pdf?arnumber=7501510
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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3. Anomalous increase of leakage current in epoxy moulding compounds under wet conditions;Solid-State Electronics;2023-10
4. Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents;IEEE Transactions on Dielectrics and Electrical Insulation;2018-12
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