Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture-Reference-Cited by-同舟云学术

Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture

Published:2018-09 Issue: Volume:88-90 Page:752-755
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Cornigli D.^ORCID,Reggiani S.,Gnudi A.,Gnani E.,Baccarani G.,Fabiani D.,Varghese D.,Tuncer E.,Krishnan S.,Nguyen L.

Funder

Texas Instruments

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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3. Characterization and TCAD Modeling of the Lateral Space Charge Accumulation in Epoxy Molding Compound in Packaged HV-ICs;IEEE Transactions on Electron Devices;2024-04

4. Understanding the role of encapsulation layers under wet conditions on the reliability of power devices;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

5. Anomalous increase of leakage current in epoxy moulding compounds under wet conditions;Solid-State Electronics;2023-10