Anomalous increase of leakage current in epoxy moulding compounds under wet conditions
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Bismaleimide/phenolic/epoxy ternary resin system for molding compounds in high-temperature electronic packaging applications;Li;Ind Eng Chem Res,2022
2. Reliability of wide band gap power electronic semiconductor and packaging: A review;Wang;Energies,2022
3. Reliability of high-voltage molding compounds: Particle size, curing time, sample thickness, and voltage impact on polarization;Garcia;IEEE Trans Ind Electron,2016
4. Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture;Cornigli;Microelectron Reliab,2018
5. Space charge redistribution in epoxy mold compounds of high-voltage ICs at dry and wet conditions: Theory and experiment;Ahn;IEEE Trans Dielectr Electr Insul,2021
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