Reliability Challenges with Self-Heating and Aging in FinFET Technology-Reference-Cited by-同舟云学术

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Reliability Challenges with Self-Heating and Aging in FinFET Technology

Published:2019-07 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 25th International Symposium on On-Line Testing and Robust System Design (IOLTS)
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Author:

Amrouch Hussam,Santen Victor M. van,Prakash Om,Kattan Hammam,Salamin Sami,Thomann Simon,Henkel Jorg

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8846168/8854369/08854405.pdf?arnumber=8854405

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores;ACM Transactions on Embedded Computing Systems;2024-06-29

2. Impact of Self-Heating in 5nm FinFETs at Cryogenic Temperatures for Reliable Quantum Computing: Device-Circuit Interaction;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14

3. FinFET to GAA MBCFET: A Review and Insights;IEEE Access;2024

4. Transistor Self-Heating-Aware Synthesis for Reliable Digital Circuit Designs;IEEE Transactions on Circuits and Systems I: Regular Papers;2023-12

5. Effects of Thermal Boundary Resistance on Thermal Management of Gallium-Nitride-Based Semiconductor Devices: A Review;Micromachines;2023-11-08

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