Application of C-mode Scanning Acoustic Microscopy in Packaging

Author:

Ma Lili,Bao Shengxiang,Lv Dechun,Du Zhibo,Li Shilan

Publisher

IEEE

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints;Nondestructive Testing and Evaluation;2023-12-08

2. A 16 element antenna integrated package for 37 – 40GHz operation;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects;International Journal of Production Research;2020-09-27

4. A Framework to Assess the Security of Advanced Integrated Circuit (IC) Packaging;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15

5. Non-immersive Ultrasound Scanning and Inspection of Internal Defects Using a Water Droplet Coupling Device;Journal of Nondestructive Evaluation;2016-03-28

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