A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects
Author:
Affiliation:
1. School of Management, Xi’an Jiaotong University, Xi’an, People’s Republic of China
2. School of Data Science, City University of Hong Kong, Hong Kong S.A.R., People’s Republic of China
Funder
National Natural Science Foundation
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Link
https://www.tandfonline.com/doi/pdf/10.1080/00207543.2020.1821928
Reference39 articles.
1. An Introduction to Kernel and Nearest-Neighbor Nonparametric Regression
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