Author:
Ghosh Sudeep,Roy Surajit Kumar,Rahaman Hafizur,Giri Chandan
Cited by
4 articles.
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1. Repairing TSVs for 3D ICs Using Redundant TSV;Proceedings of International Conference on Industrial Instrumentation and Control;2022
2. An Effective Coding Transmission Scheme for Defect-involved TSV Array Transmission;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
3. Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer;2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA);2021-11-24
4. Clustered Fault Repairing Architecture for 3D ICs Using Redundant TSV;Proceedings of International Conference on Innovations in Software Architecture and Computational Systems;2021