Design and Development of Manifolds for Parallel Flow and Counter Flow in Two-Phase Cooling of 3D ICs
Author:
Affiliation:
1. Institute of Microelectronics, A*STAR (Agency for Science Technology and Research),Singapore,138634
2. Institute of High Performance Computing, A*STAR (Agency for Science, Technology and Research),Singapore,138632
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013305.pdf?arnumber=10013305
Reference20 articles.
1. Comparative study on the enhancement of spray cooling heat transfer using conventional and bio-surfactants
2. Review on high heat flux flow boiling of refrigerants and water for electronics cooling
3. Design automation and testing of monolithic 3D ICs: Opportunities, challenges, and solutions: (Invited paper)
4. An Overview of Design, Fabrication, and Cooling Techniques of 3D-ICs
5. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
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3. Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
4. Development of Crossflow Manifold for Two-Phase Liquid Cooling of 3D ICs via 3D Printing;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
5. Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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