Extreme Contact Scaling with Advanced Metallization of Cobalt-Reference-Cited by-同舟云学术

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Extreme Contact Scaling with Advanced Metallization of Cobalt

Published:2018-06 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE International Interconnect Technology Conference (IITC)
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Author:

Hung Raymond,Park Jin Hee,Ha Tae Hong,Lee Mark,Hou Wenting,Lei Jianxin,Bakke Jonathan R.,Sharma Shashank,Sharma Karthik Raman,Kim Nam Sung,Yeh Ellie,Wachs Amir

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8411791/8430288/08430434.pdf?arnumber=8430434

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The impact of titanium alloying on altering nanomechanical properties and grain structures of sputter-deposited cobalt for electromigration reliability enhancement;Journal of Alloys and Compounds;2024-10

2. The feasibility of an ultrathin dual-barrier scheme to inhibit interfacial diffusion and reactions in contact stacks of Co/NiSi/Si;Surfaces and Interfaces;2024-08

3. Fermi-level depinning in Mo/Si junctions by insertion of amorphous Si-rich Mo silicide film formed via gas-phase reactions of MoF₆ with SiH₄;Japanese Journal of Applied Physics;2024-01-04

4. Understanding electromigration failure behaviors of narrow cobalt lines and the mechanism of reliability enhancement for extremely dilute alloying of manganese oxide;Journal of Alloys and Compounds;2024-01

5. Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor;Beilstein Journal of Nanotechnology;2023-09-15

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