Reliability Simulation and Circuit-Failure Analysis in Analog and Mixed-Signal Applications-Reference-Cited by-同舟云学术

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Reliability Simulation and Circuit-Failure Analysis in Analog and Mixed-Signal Applications

Published:2009-09 Issue:3 Volume:9 Page:339-347
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Baoguang Yan ,Qingguo Fan ,Bernstein J.B.,Jin Qin ,Jun Dai

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/7298/5226698/04814578.pdf?arnumber=4814578

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A HCI-hardened self-healing operational amplifier circuit;Microelectronics Reliability;2023-12

2. Defect localization on operating condition failure of 3D NAND device level using modified Lock-in thermography;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

3. Absorption Markov Lifetime Evaluation Model Based on Weibull Distribution;2022 10th International Symposium on Next-Generation Electronics (ISNE);2023-05-12

4. Self‐healing digital‐to‐analogue converter architecture for communication equipment with ordered element‐matching technology;The Journal of Engineering;2021-08-04

5. Calibration for Computer Experiments With Binary Responses and Application to Cell Adhesion Study;Journal of the American Statistical Association;2020-01-21

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