Author:
Kiguradze Zurab,He Jiayi,Mutnury Bhyrav,Chada Arun,Drewniak James
Cited by
13 articles.
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1. ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning;2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC);2024-01-22
2. ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-01
3. Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications;IEEE Transactions on Microwave Theory and Techniques;2024-01
4. Method of Exploring HVM Process Corner Cases for Loss and Impedance in High Speed Designs;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
5. Machine Learning Based PCB/Package Stack-up Optimization for Signal Integrity;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05