ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design-Reference-Cited by-同舟云学术

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ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design

Published:2024-01 Issue:1 Volume:43 Page:2-15
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Chae Hyunsu¹^ORCID,Zhu Keren¹^ORCID,Mutnury Bhyrav²,Wallace Douglas E.²^ORCID,Winterberg Douglas S.²,de Araujo Daniel³^ORCID,Reddy Jay¹,Klivans Adam⁴,Pan David Z.¹^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX, USA

2. Dell Technologies, Austin, TX, USA

3. Siemens EDA, Cedar Park, TX, USA

4. Department of Computer Science, The University of Texas at Austin, Austin, TX, USA

Funder

NSF

NSF through the AI Institute: Institute for Foundations of Machine Learning

NSF AI Institute for Learning-Enabled Optimization at Scale

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

https://ieeexplore.ieee.org/ielam/43/10372473/10227538-aam.pdf

Reference33 articles.

1. Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

2. Next-Generation High-Density PCB Development by Fan-Out RDL Technology

3. Interconnect design for deep submicron ICs

4. PCB stack-up design and optimization for next generation speeds

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A comprehensive review of model compression techniques in machine learning;Applied Intelligence;2024-09-02

2. Deep Neural Network-Based Surrogate-Assisted Inverse Optimization for High-Speed Interconnects;IEEE Transactions on Electromagnetic Compatibility;2024

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