ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning-Reference-Cited by-同舟云学术

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ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning

Published:2024-01-22 Issue: Volume: Page:644-650
ISSN:
Container-title:2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)
language:
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Author:

Chae Hyunsu¹,Zhu Keren¹,Mutnury Bhyrav²,Jiang Zixuan¹,De Araujo Daniel³,Wallace Douglas²,Winterberg Douglas²,Klivans Adam⁴,Pan David Z.¹

Affiliation:

1. The University of Texas at Austin,ECE Department,Austin,TX,USA

2. Dell Infrastructure Solutions Group,Round Rock,TX,USA

3. Electronic Board Systems, Siemens EDA,Austin,TX,USA

4. The University of Texas at Austin,CS Department,Austin,TX,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10473777/10473787/10473886.pdf?arnumber=10473886

Reference14 articles.

1. An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging

2. Bayesian Optimization for Stack-up Design

3. Hyperparameter optimization: A spectral approach;Hazan

4. ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design

5. Machine Learning for Analog Circuit Sizing

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