ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design
Author:
Affiliation:
1. The University of Texas at Austin,ECE Department,Austin,TX,USA
2. Dell Infrastructure Solutions Group,Round Rock,TX,USA
3. Electronic Board Systems, Siemens EDA,Austin,TX,USA
4. The University of Texas at Austin,CS Department,Austin,TX,USA
Funder
NSF
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10136870/10136706/10137055.pdf?arnumber=10137055
Reference26 articles.
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Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Multiobjective Optimization for PSIJ Mitigation and Impedance Improvement Based on PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-08
2. ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning;2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC);2024-01-22
3. ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-01
4. Method of Exploring HVM Process Corner Cases for Loss and Impedance in High Speed Designs;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
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