Numerical investigation of glass-weave effects on high-speed interconnects in printed circuit board

Author:

Tian Xinxin,Zhang Yao-Jiang,Lim Jane,Qiu Kelvin,Brooks Rick,Zhang Ji,Fan Jun

Publisher

IEEE

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Analysis of Optimum Rotation Angle for Mitigating P/N Skew Based on Geometrical Method;2024 IEEE 28th Workshop on Signal and Power Integrity (SPI);2024-05-12

2. Analysis about High-Speed Trace in PCB of Glass-Weave: The effect of the PCB of Glass-Weave on insertion loss, impedance and phase of high-speed trace;Proceedings of the 2023 7th International Conference on Electronic Information Technology and Computer Engineering;2023-10-20

3. Dielectric Loss Tangent Extraction Using Two Single-ended Striplines of Different Width;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01

4. The Simulated TDR Impedance In PCB Material Characterization;2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium;2021-07-26

5. Far-End Crosstalk Analysis for Stripline with Inhomogeneous Dielectric Layers (IDL);2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium;2021-07-26

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