Modeling and analysis of package PDN for computing system based on cavity model

Author:

Cho Jonghyun,Bai Siqi,Zhao Biyao,Ruehli Albert,Drewniak James,Cocchini Matteo,Connor Samuel,Cracraft Michael A,Becker Dale

Publisher

IEEE

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. On-Die Power-Rails Isolation Using Package Loop Inductance;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. PEEC Modeling in 3D IC/Packaging Applications Based on Layered Green's Functions;IEEE Transactions on Signal and Power Integrity;2023

3. Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Accurate Inductance Models of Mounted Two-Terminal Decoupling Capacitors;IEEE Transactions on Electromagnetic Compatibility;2021-02

5. Modeling of Loaded Nonuniform Grid Power Distribution Network With Arbitrary Shapes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-01

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