PEEC Modeling in 3D IC/Packaging Applications Based on Layered Green's Functions
Author:
Affiliation:
1. Missouri University of Science and Technology, Rolla, MO, USA
2. Cisco Systems, Inc., San Jose, CA, USA
Funder
National Science Foundation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
https://ieeexplore.ieee.org/ielam/9745882/10040918/10045792-aam.pdf
Reference32 articles.
1. Discrete complex image method for Green's functions of general multilayer media
2. Efficient Capacitance Calculations for Three-Dimensional Multiconductor Systems
3. Multilayered media Green's functions in integral equation formulations
4. A direct discrete complex image method from the closed-form Green's functions in multilayered media
5. Closed-Form Green's Functions in Planar Layered Media for All Ranges and Materials
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3. Full-Wave Equivalent Circuit Characterization for Large-Scale Microstrip Transmission Lines;2023 International Applied Computational Electromagnetics Society Symposium (ACES-China);2023-08-15
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