Virtual Measurement Combine OCD and FDC Through Optimized Random Forest Machine Learning Algorithm Assists on Post Etching Monitor
Author:
Affiliation:
1. SiEn (Qingdao) Integrated Circuits Co., Ltd,Qingdao,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10531806/10531771/10531947.pdf?arnumber=10531947
Reference5 articles.
1. A Neural Network Approach to Analyze FDC Data in Semiconductor Manufacture
2. Virtual metrology for semiconductor manufacturing: Focus on transfer learning
3. Adaptive Virtual Metrology Design for Semiconductor Dry Etching Process Through Locally Weighted Partial Least Squares
4. Development of the Virtual Metrology for the Nitride Thickness in Multi-Layer Plasma-Enhanced Chemical Vapor Deposition Using Plasma-Information Variables
5. Enhancement of the Virtual Metrology Performance for Plasma-Assisted Oxide Etching Processes by Using Plasma Information (PI) Parameters
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