Virtual metrology for semiconductor manufacturing: Focus on transfer learning-Reference-Cited by-同舟云学术

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Virtual metrology for semiconductor manufacturing: Focus on transfer learning

Published:2021-08-23 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 17th International Conference on Automation Science and Engineering (CASE)
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Author:

Clain Rebecca,Borodin Valeria,Juge Michel,Roussy Agnes

Funder

ECSEL JU

European Union's Horizon 2020 research and innovation program and France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9551387/9551265/09551567.pdf?arnumber=9551567

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Virtual metrology in semiconductor manufacturing: Current status and future prospects;Expert Systems with Applications;2024-09

2. Virtual Measurement Combine OCD and FDC Through Optimized Random Forest Machine Learning Algorithm Assists on Post Etching Monitor;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

3. Virtual metrology for enabling zero-defect manufacturing: a review and prospects;The International Journal of Advanced Manufacturing Technology;2024-01-09

4. Virtual Metrology Modeling for Wafer Edges via Graph Attention Networks;IEEE Transactions on Semiconductor Manufacturing;2023-08

5. A Neural Network Approach to Analyze FDC Data in Semiconductor Manufacture;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20

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