High-Resolution Time Domain Reflectometry in Advanced Package Failure Analysis
Author:
Affiliation:
1. Advantest (China) Co., Ltd,Shanghai,China,201203
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10531806/10531771/10532001.pdf?arnumber=10532001
Reference10 articles.
1. Recent Advances and Trends in Advanced Packaging
2. Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology
3. A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
4. Package–on–Package – Review on a Promising Packaging Technology
5. Hybrid Modelling for the Failure Analysis of SiC Power Transistors on Time-Domain Reflectometry Data
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