A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging-Reference-Cited by-同舟云学术

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Published:2023-05-29 Issue:6 Volume:14 Page:1149
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Wang Haoyu¹^ORCID,Ma Jianshe¹,Yang Yide¹,Gong Mali²,Wang Qinheng³

Affiliation:

1. Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China

2. Department of Precision Instrument, Tsinghua University, Beijing 100084, China

3. Shanghai Kulan Electronic Technology Co., Shanghai 200040, China

Abstract

The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

Funder

National key research and development program “Information Photonics Technology” Key Project

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Link

https://www.mdpi.com/2072-666X/14/6/1149/pdf

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