Scaling M-Series™ for Chiplets
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501572.pdf?arnumber=9501572
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
3. Multiple System and Heterogeneous Integration with TSV-Less Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Mask-less Laser Direct Imaging & Adaptive Patterning Solution for Fan-Out Heterogeneous Integration on 600mm;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
5. Thermal Debonding: A Fundamental to Fanout Manufacturing;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
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