Thermal Debonding: A Fundamental to Fanout Manufacturing
Author:
Affiliation:
1. FOWLP Equipment Business Unit ERS electronic GmbH,Germering/Munich,Germany
2. Sales and Marketing ERS electronic GmbH,Germering/Munich,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939410.pdf?arnumber=9939410
Reference8 articles.
1. Latest material technologies for Fan-Out Wafer Level Package
2. Material and process trends for moving from FOWLP to FOPLP
3. Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
4. Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
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1. How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Laser debonding application in ultra-thin device processing;Applied Optics;2023-08-02
3. Warpage of Fan-Out Panel Level Packaging – Experimental and Numerical Study of Geometry and Process Influence;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
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