Author:
Chong Ser Choong,Lim Simon Siak Boon,Seit Wen Wei,Chai Tai Chong,Sanchez Debbie Claire
Cited by
7 articles.
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1. Comparable Study for Redistribution Layers in FO POP RDL First and Last (Fan-Out Package on Package);2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Floorplet: Performance-Aware Floorplan Framework for Chiplet Integration;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023
3. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Multiple System and Heterogeneous Integration with TSV-Less Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023
5. Multi-Package Co-Design for Chiplet Integration;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30