Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging-Reference-Cited by-同舟云学术

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Published:2017-10 Issue:10 Volume:7 Page:1729-1738
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lau John H.^ORCID,Li Ming,Tian Dewen,Fan Nelson,Kuah Eric,Kai Wu,Li Margie,Hao J.,Cheung Yiu Ming,Li Zhang,Tan Kim Hwee,Beica Rozalia,Taylor Thomas,Ko Cheng-Ta,Yang Henry,Chen Yu-Hua,Lim Sze Pei,Lee Ning Cheng,Ran Jiang,Xi Cao,Wee Koh Sau,Yong Qingxiang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/8059915/07979625.pdf?arnumber=7979625

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