Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year

Author:

Lall Pradeep,Zhang Yunli,Kasturi Madhu,Choudhury Padmanava,Wu Haotian,Suhling Jeff,Davis Edward

Funder

Semiconductor Research Corporation

Publisher

IEEE

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Corrosion Kinetics Investigation on Cu-Al Alloy in Sulfate Environment under Various Temperature and pH Values;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

2. Characterization of Aging Effects on Thermal and Mechanical Properties of Magnetically-Oriented ACA for Flexible and Stretchable Electronics;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

3. Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches;Journal of Electronic Packaging;2023-01-27

4. Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

5. Damage Progression in Electronic Molding Compounds under Sustained High Temperature for up to 1-year in Automotive Underhood Environments;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

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