Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures
Author:
Affiliation:
1. Auburn University NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899528.pdf?arnumber=9899528
Reference27 articles.
1. Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
2. Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year
3. Modeling of Effect of Underfill Properties on Flip Chip Bumps and Solder Balls of FCBGA Package in Automotive Underhood Applications
4. Board level solder reliability vs. ramp rate & dwell time during temperature cycling
5. Effects of dwell time and ramp rate on lead-free solder joints in FCBGA packages;fan;Proceedings Electronic Components and Technology, 2005. ECTC '05.,2005
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