Damage Progression in Electronic Molding Compounds under Sustained High Temperature for up to 1-year in Automotive Underhood Environments
Author:
Affiliation:
1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,USA,36849
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899521.pdf?arnumber=9899521
Reference15 articles.
1. Effect of High Temperature Long Term Aging on Stress-Strain Behavior of Underfills;lall;TECHCON 2020,0
2. Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year
3. Degradation Mechanisms of Epoxy Molding Compound Subjected to High Temperature Long Term Aging
4. Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging
5. Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging
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