A Single-Layer Mechanical Debonding Adhesive for Advanced Wafer-Level Packaging
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501851.pdf?arnumber=9501851
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of Thermal Resistant Temporary Bonding Material for Fan-out Wafer Level Packaging: Dual-curing and Dual-debonding Strategies are Available;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. A Single-layer Photosensitive Polymer Material for Temporary Bonding and Laser Debonding;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31
4. A Novel Single-Layer High-Temperature-Resistant Adhesive Layer Applied in Advanced Wafer-Level Packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
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